Butyl-diallyl-isocyanurat | 5320-28-5

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 英文名称: Butyl-diallyl-isocyanurat
• 英文别名: 1,3-diallyl-5-butyl-[1,3,5]triazinane-2,4,6-trione；1-Butyl-3,5-bis(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione
• CAS: 5320-28-5
• 化学式: C₁₃H₁₉N₃O₃
• 分子量: 265.312
• InChiKey: PAHMGXAOLVQORP-UHFFFAOYSA-N

物化性质

• 沸点：
  159 °C(Press: 4 Torr)
• 密度：
  1.1071 g/cm3

计算性质

• 辛醇/水分配系数(LogP)：
  1.9
• 重原子数：
  19
• 可旋转键数：
  7
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.46
• 拓扑面积：
  60.9
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• RESIST UNDERLAYER FILM FORMING COMPOSITION CONTAINING SILICON HAVING NITROGEN-CONTAINING RING
  申请人：Nakajima Makoto

  公开号：US20120315765A1

  公开（公告）日：2012-12-13

  There is provided a resist underlayer film forming composition for lithography for forming a resist underlayer film capable of being used as a hardmask. A resist underlayer film forming composition for lithography, includes as a silane compound, a hydrolyzable organosilane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof, wherein the hydrolyzable organosilane is a hydrolyzable organosilane of Formula (1): R 1 a R 2 b Si(R 3 ) 4−(a+b) Formula (1) wherein R 1 is Formula (2): in which R 4 is an organic group, and R 5 is a C 1-10 alkylene group, a hydroxyalkylene group, a sulfide bond, an ether bond, an ester bond, or a combination thereof, X 1 is Formula (3), Formula (4), or Formula (5): R 2 is an organic group, and R 3 is a hydrolysable group.

  提供了一种用于制备可用作硬面膜的光刻胶底层膜的抗性底层膜形成组合物。一种用于光刻胶底层膜形成的抗性底层膜形成组合物，包括硅烷化合物作为成分，所述硅烷化合物是可水解的有机硅烷、其水解产物或其水解缩合物，其中所述可水解的有机硅烷是式(1)的可水解的有机硅烷： R1aR2bSi(R3)4−(a+b) 式(1) 其中R1是式(2)： 其中R4是有机基团，R5是C1-10烷基、羟基烷基、硫化键、醚键、酯键或其组合，X1是式(3)、式(4)或式(5)： R2是有机基团，R3是可水解基团。
• CURABLE RESIN COMPOSITION, AND CURED PRODUCT, SEALING AGENT, AND OPTICAL SEMICONDUCTOR DEVICE USING SAME
  申请人：Daicel Corporation

  公开号：EP2857457A1

  公开（公告）日：2015-04-08

  Provided is a curable resin composition capable of forming a cured product that excels in heat resistance, transparency, and flexibility and particularly excels in barrier properties against a corrosive gas (e.g., sulfur oxide). The curable resin composition includes a compound (U) containing an aliphatic carbon-carbon unsaturated bond and a compound (H) containing a hydrosilyl group and includes at least one of a ladder-type silsesquioxane [A1] and a ladder-type silsesquioxane [A2], where the ladder-type silsesquioxane [A1] contains an aliphatic carbon-carbon unsaturated bond and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard, and the ladder-type silsesquioxane [A2] contains a hydrosilyl group and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard.

  本发明提供了一种可固化树脂组合物，该组合物能够形成具有优异耐热性、透明度和柔韧性的固化产品，尤其是对腐蚀性气体（如氧化硫）具有优异的阻隔性能。 可固化树脂组合物包括含有脂肪族碳-碳不饱和键的化合物（U）和含有氢硅烷基的化合物（H），并包括梯形硅倍半氧烷[A1]和梯形硅倍半氧烷[A2]中的至少一种，其中梯形硅倍半氧烷[A1]含有脂肪族碳-碳不饱和键，其数均分子量为 500-1500，分子量分散度（Mw/Mn）为 1.阶梯型硅倍半氧烷[A2]含有一个氢硅烷基，平均分子量为500-1500，分子量分散度（Mw/Mn）为1.00-1.40（通过凝胶渗透色谱法测定，并用聚苯乙烯标准校准）。
• ADDITION CURING SILICONE COMPOSITION FOR CIPG THAT YIELDS CURED PRODUCT WITH EXCELLENT COMPRESSION SET, AND METHOD OF REDUCING COMPRESSION SET OF CURED PRODUCT OF THE COMPOSITION
  申请人：HARA Hiroyasu

  公开号：US20070112149A1

  公开（公告）日：2007-05-17

  Provided is an addition curing silicone composition for CIPQ including: (A) 100 parts by mass of an organopolysiloxane containing at least two alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane, in sufficient quantity to provide from 0.4 to 10.0 mols of hydrogen atoms bonded to silicon atoms within this component (B) for every 1 mol of alkenyl groups bonded to silicon atoms within the entire composition, (C) an effective quantity of a platinum group metal-based catalyst, (D) a curing retarder, and (E) an acid-receiving agent which is inorganic. The composition yields a cured product with particularly superior compression set, and exhibits excellent storage stability, curing stability (curability following storage), and adhesion. The compression set for a cured product of an addition curing silicone composition including the aforementioned components (A) through (D) can be reduced by preparing a composition including said components (A) through (E) and curing said composition including said components (A) through (E) at room temperature or under heating.
• Silane Coupling Agents for Printed Circuit Boards
  申请人：Gelorme Jeffrey Donald

  公开号：US20100212944A1

  公开（公告）日：2010-08-26

  The present invention is directed to silane coupling agents for printed circuit boards, such as high-temperature printed circuit boards (PCBs), a process for synthesizing the silane coupling agent, and PCBs with such coupling agents. The silane coupling agent is defined by the following formula: wherein at least one R′ is an allyl and the other one is hydrogen, an alkyl, a cycloalkyl, an aryl, a heteroaryl, a non-aromatic heterocyclic ring, or an allyl; and R 1 is an alkyl, a cycloalkyl, an aryl, a heteroaryl, a non-aromatic heterocyclic ring, or an allyl.
• CURABLE COMPOSITION
  申请人：Ichiryu Yoshikatsu

  公开号：US20100222525A1

  公开（公告）日：2010-09-02

  Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same. Disclosed is a modified polyorganosiloxane compound having two or more epoxy group and/or oxetanyl group in a molecule, the compound being a hydrosilylation reaction product of the following compounds: (α 1 ) an organic compound having 2 to 6 carbon-carbon double bonds reactive with a SiH group in a molecule; (β1) a linear and/or cyclic polyorganosiloxane compound having at least two SiH groups in a molecule; and (γ1) an organic compound having at least one epoxy group or oxetanyl group and one carbon-carbon double bond reactive with a SiH group in a molecule.