6-(octadecylamino)-1H-1,3,5-triazine-2,4-dithione | 29556-81-8

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 英文名称: 6-(octadecylamino)-1H-1,3,5-triazine-2,4-dithione
• CAS: 29556-81-8
• 化学式: C₂₁H₄₀N₄S₂
• 分子量: 412.7
• InChiKey: MHYXZOVTQGTECQ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  10.1
• 重原子数：
  27
• 可旋转键数：
  18
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.86
• 拓扑面积：
  52.7
• 氢给体数：
  3
• 氢受体数：
  6

文献信息

• [EN] SUBSTITUTED TRIAZINE COMPOUNDS AND USES THEREOF<br/>[FR] COMPOSÉS DE TRIAZINE SUBSTITUÉS ET LEURS UTILISATIONS
  申请人：MUSC FOUND FOR RES DEV

  公开号：WO2021141984A1

  公开（公告）日：2021-07-15

  The present invention relates to compounds of formula (I) : including any stereochemically isomeric form thereof, or pharmaceutically acceptable salts thereof, for the treatment of, for example, hypercholesterolemia.

  本发明涉及式(I)的化合物：包括其任何立体异构体形式或其药学上可接受的盐，用于治疗例如高胆固醇血症等疾病。
• METAL RESIN COMPLEX
  申请人：Kaneka Corporation

  公开号：EP3305519A1

  公开（公告）日：2018-04-11

  The present invention provides a metal resin composite including a thermally conductive resin composition and a surface-treated metal which are integrally molded by injection molding to be tightly joined to each other at an interface between the resin and the metal, the metal resin composite excelling in heat radiation property and moldability, being light in weight, and being easily producible. The metal resin composite includes a member made of thermally conductive resin composition and a member made of metal and including a surface on which fine recesses are formed by a surface treatment, these members contacting with each other and being joined to each other in such a manner that the thermally conductive resin composition flows into and is fixed to the recesses by injection molding of the thermally conductive resin composition, wherein: the thermally conductive resin composition contains a thermoplastic resin (A) and an inorganic filler (B); thermal conductivity of the thermally conductive resin composition in a surface direction (In-Plane thermal conductivity) is 1 W/(m·K) or more; and the inorganic filler (B) is at least one selected from the group consisting of inorganic particles (B1) having thermal conductivity of 2 W/(m·K) or more and a volume average particle diameter of 1 to 700 µm and inorganic fibers (B2) having thermal conductivity of 1 W/(m·K) or more, a number average fiber diameter of 1 to 50 µm, and a number average fiber length of 6 mm or less.

  本发明提供了一种金属树脂复合材料，包括导热树脂组合物和表面处理过的金属，它们通过注塑成型一体成型，在树脂和金属的界面处彼此紧密连接，该金属树脂复合材料具有优异的热辐射性能和成型性，重量轻，易于生产。金属树脂复合材料包括由导热树脂组合物制成的构件和由金属制成的构件，金属构件的表面通过表面处理形成细小凹槽，这些构件相互接触并相互连接，通过导热树脂组合物的注塑成型，导热树脂组合物流入凹槽并固定在凹槽上，其中：导热树脂组合物包含热塑性树脂 (A) 和无机填料 (B)； 导热树脂组合物在表面方向上的导热系数（平面内导热系数）为 1 W/(m-K) 或更高；无机填料 (B) 至少选自以下组别：导热系数为 2 W/(m-K) 或以上、体积平均颗粒直径为 1 至 700 µm 的无机颗粒 (B1) 和导热系数为 1 W/(m-K) 或以上、平均纤维直径为 1 至 50 µm、平均纤维长度为 6 mm 或以下的无机纤维 (B2)。
• Thiol compound derivative, hardening compositions containing these derivatives and molded articles thereof
  申请人：——

  公开号：US20040162368A1

  公开（公告）日：2004-08-19

  The present invention relates to a thiol compound derivative represented by the following formula (1), a curable composition containing the derivative, and a molded product made of the composition. More particularly, the invention relates to a thiol compound derivative which is added to a polymer having reactivity to a thiol derivative substituent to provide a curable composition, a curable composition containing the derivative and a crosslinkable halogen-containing crosslinking polymer, and a crosslinked molded product of the composition. 1 wherein X 1 , X 2 and X 3 are each a group represented by the following formula (2). 2

  本发明涉及由下式（1）表示的硫醇化合物衍生物、含有该衍生物的可固化组合物以及由该组合物制成的模塑产品。更具体地说，本发明涉及一种硫醇化合物衍生物，将其添加到对硫醇衍生物取代基具有反应活性的聚合物中，以提供一种可固化组合物、一种含有该衍生物和一种可交联含卤交联聚合物的可固化组合物，以及一种由该组合物制成的交联模塑产品。 1 其中 X 1 , X 2 和 X 3 分别是下式（2）所代表的一个基团。 2
• THIOL COMPOUND DERIVATIVES, HARDENING COMPOSITIONS CONTAINING THESE DERIVATIVES AND MOLDED ARTICLES THEREOF
  申请人：Unimatec Co., Ltd.

  公开号：EP1394153B1

  公开（公告）日：2010-12-29
• METAL RESIN COMPOSITE
  申请人：Kaneka Corporation

  公开号：EP3305519B1

  公开（公告）日：2021-06-30