[4-(3,4-Dimethylbenzoyl)oxyphenyl] 3,4-dimethylbenzoate | 51933-70-1

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 缩酚酸和缩酚酸环醚类
• 英文名称: [4-(3,4-Dimethylbenzoyl)oxyphenyl] 3,4-dimethylbenzoate
• CAS: 51933-70-1
• 化学式: C₂₄H₂₂O₄
• 分子量: 374.436
• InChiKey: ZIFUDCQHWRIUGS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.2
• 重原子数：
  28
• 可旋转键数：
  6
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.17
• 拓扑面积：
  52.6
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• Photosensitive polyimide composition and photoresist film made thereof
  申请人：eChem Solutions Corp.

  公开号：US11029598B2

  公开（公告）日：2021-06-08

  The present invention provides a photosensitive polyimide composition comprising a polyimide resin having a structural unit represented by the formula (1) and a structural unit represented by the formula (2), a quinonediazide sulfonate, a thermal curing agent, and a thermal acid generator. In the formulas (1) and (2), n is an integer of 10 to 600, Ar1 is a tetravalent organic group; Ar2 is a divalent to tetravalent organic group; Ar3 is a divalent aromatic group; and R1 is an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.

  本发明提供了一种光敏聚酰亚胺组合物，该组合物由具有式（1）表示的结构单元和式（2）表示的结构单元的聚酰亚胺树脂、醌噻嗪磺酸盐、热固化剂和热酸发生器组成。 在式 (1) 和 (2) 中，n 是 10 至 600 的整数，Ar1 是四价有机基团；Ar2 是二价至四价有机基团；Ar3 是二价芳香基团；R1 是 OH 基团或 COOH 基团。本发明还提供了一种由上述光敏聚酰亚胺组合物制成的光刻胶膜。
• POLYIMIDE COMPOSITE MATERIAL AND FILM OF THE SAME
  申请人：Mitsui Chemicals, Inc.

  公开号：EP2218754B1

  公开（公告）日：2018-06-20
• PROCESS FOR PRODUCING POLYIMIDE FILM, AND POLYIMIDE FILM
  申请人：Yamaguchi Hiroaki

  公开号：US20080261060A1

  公开（公告）日：2008-10-23

  A solution containing a polyamic acid oligomer having at least one terminal alkoxysilyl group is applied to one side or both sides of a self-supporting film of a polyimide precursor solution, and then the self-supporting film is heated to effect imidization, thereby providing a polyimide film with reliably improved adhesiveness.
• LAMINATE OF HEAT RESISTANT FILM AND METAL FOIL, AND METHOD FOR PRODUCTION THEREOF
  申请人：Iizumi Nobu

  公开号：US20100203324A1

  公开（公告）日：2010-08-12

  A laminate of the present invention is a laminate having a metal foil on one side or both sides of a heat resistant film in which the metal foil is laminated on the heat resistant film via a cured layer of a terminal-modified oligomer obtained by reacting simultaneously or successively a tetracarboxylic dianhydride and a diamine in a molar ratio of n:(n+1) (n is a number of 2 to 6) and a carboxylic acid compound having an unsaturated group, which is formed by heating and reacting the terminal-modified oligomer. The laminate of a heat resistant film and a metal foil may be easily produced. Moreover, the laminate may have excellent adhesive properties and excellent heat resistance, and withstand a soldering process or a high temperature process for mounting a chip on a substrate.
• POLYIMIDE COMPOSITE MATERIAL AND FILM THEREOF
  申请人：Fukukawa Kenichi

  公开号：US20100304160A1

  公开（公告）日：2010-12-02

  A polyamic acid solution according to the present invention includes a polyamic acid, a solvent (C) in which the polyamic acid (PAA1) is dissolved, and a substance (M) that can release at least one metal selected from groups 1 and 2 of the periodic table as a metal ion, or a substance (m) that contains the substance (M). A polyimide composite according to the present invention is produced from the polyamic acid solution. The present invention provides a polyimide composite having a greatly improved glass transition temperature without impairing the intrinsic physical properties of the polyimide.