4-[Bis[3,5-bis(butoxymethyl)-4-hydroxyphenyl]methyl]-2,6-bis(butoxymethyl)phenol

• 分子结构分类: 有机化合物 - 苯类化合物 - 三苯基化合物
• 英文名称: 4-[Bis[3,5-bis(butoxymethyl)-4-hydroxyphenyl]methyl]-2,6-bis(butoxymethyl)phenol
• 英文别名: 4-[bis[3,5-bis(butoxymethyl)-4-hydroxyphenyl]methyl]-2,6-bis(butoxymethyl)phenol
• 化学式: C₄₉H₇₆O₉
• 分子量: 809.1
• InChiKey: IEFLBKHTRBZSOK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  9.6
• 重原子数：
  58
• 可旋转键数：
  33
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.63
• 拓扑面积：
  116
• 氢给体数：
  3
• 氢受体数：
  9

文献信息

• RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20170299965A1

  公开（公告）日：2017-10-19

  A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.
• US8709552B2
  申请人：——

  公开号：US8709552B2

  公开（公告）日：2014-04-29