triphenylmethylamine hydrobromide | 950752-66-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 三苯基化合物
• 英文名称: triphenylmethylamine hydrobromide
• 英文别名: Tritylazanium;bromide
• CAS: 950752-66-6
• 化学式: BrH*C₁₉H₁₇N
• 分子量: 340.263
• InChiKey: ILWWDNPHCKOHSU-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.22
• 重原子数：
  21
• 可旋转键数：
  3
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.05
• 拓扑面积：
  27.6
• 氢给体数：
  1
• 氢受体数：
  1

反应信息

• 作为产物：
  描述：

  三苯甲胺 、 3-溴丙炔 以 乙腈 为溶剂， 反应 72.0h， 以40%的产率得到N-tritylpropargylamine
  参考文献：
  名称：

  丙烯醛衍生的 N-烯丙胺：合成和用作两种亲核试剂的受体

  摘要：

  已经开发了两种实用的方法来制备 N-烯丙基胺 1b,c。一种涉及炔丙胺的异构化，另一种涉及丙烯醛的脱水。如此制备的 N-烯丙胺 1b,c 用作 1,4- 和 1,2- 双亲核加成反应的有效底物。(© Wiley-VCH Verlag GmbH & Co. KGaA, 69451 Weinheim, Germany, 2009)

  DOI：

  10.1002/ejoc.200900457

文献信息

• Removal of organic cations from polar fluids
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0435014A1

  公开（公告）日：1991-07-03

  Cationic organic impurities such as ternary sulfonium ions and quaternary ammonium and phosphonium compounds are effectively removed from polar liquids such as water or water/alcohol mixtures by contacting the polar liquid with an absorbent comprising a trinitroarenol such as a picric acid. This method is particularly effective for removing such cationic impurities from polar liquids containing organic zwitterions.

  将极性液体与含有苦味酸等三硝基苯酚的吸收剂接触，可有效去除极性液体（如水或水/酒精混合物）中的阳离子有机杂质，如三元锍离子、季铵和鏻化合物。这种方法对于去除含有有机齐聚物的极性液体中的阳离子杂质特别有效。
• Novel low dielectric resin varnish composition for laminates and the preparation thereof
  申请人：Nan-Ya Plastics Corporation

  公开号：EP2368930A1

  公开（公告）日：2011-09-28

  This invention relates to a low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclopentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene- Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); or the mixture of (B) and (C), and (D) Flame retardant agent, curing agent and accelerating agent solutions. Because all of component (A) DCPD-PN, component (B) DCPD-PNE and component (C) DCPD-BX in this resin varnish composition contain a saturated multi-cyclic structure of dicyclopentadiene, the resin varnish shows lower dipole, dielectric constant (Dk), dissipation factor (Df) and moisture absorption; and via adding a brominated or phosphorus flame retardant, the composition exhibits high thermal stability characteristic. The copper clad laminates obtained in accordance with the invention meet not only the demand of low dielectric constant (Dk <4.0 @ 1 GHz) and low dissipation factor (Df <0.009 @ 1GNz), but also possesses high heat stability and low moisture absorption characteristics, thus are widely applied to high-performance electronic materials.

  本发明涉及一种用于层压印刷电路板的低介电树脂清漆组合物，其中树脂组合物包括(A)双环戊二烯酚醛树脂(简称DCPD-PN)；或 (B) 至少一种双环戊二烯酚醛环氧树脂（DCPD-PNE，简称树脂 1）；或 (C) 新型双环戊二烯二氢苯并恶嗪树脂（DCPD-BX，简称树脂 2）；或 (B) 和 (C) 的混合物；以及 (D) 阻燃剂、固化剂和促进剂溶液。 由于该树脂清漆组合物中的所有组分（A）DCPD-PN、组分（B）DCPD-PNE 和组分（C）DCPD-BX 都含有饱和多环结构的双环戊二烯，因此该树脂清漆具有较低的偶极子、介电常数（Dk）、耗散因子（Df）和吸湿性；通过添加溴化或磷化阻燃剂，该组合物具有较高的热稳定性。根据本发明得到的覆铜箔层压板不仅满足了低介电常数（Dk <4.0 @ 1 GHz）和低耗散因子（Df <0.009 @ 1GNz）的要求，还具有高热稳定性和低吸湿性的特点，因此被广泛应用于高性能电子材料中。
• Stabilization of alkali polysaccharides
  申请人：THE DOW CHEMICAL COMPANY

  公开号：EP0090271B1

  公开（公告）日：1987-11-19
• PROCESS FOR MODIFYING A POLYMERIC SURFACE
  申请人：3M Innovative Properties Company

  公开号：EP1453896B1

  公开（公告）日：2008-04-09
• NOVEL LOW DIELECTRIC RESIN VARNISH COMPOSITION FOR LAMINATES AND THE PREPARATION THEREOF
  申请人：TZOU Ming Jen

  公开号：US20110224345A1

  公开（公告）日：2011-09-15

  This invention relates to a low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); or the mixture of (B) and (C), and (D) Flame retardant agent, curing agent and accelerating agent solutions. Because all of component (A) DCPD-PN, component (B) DCPD-PNE and component (C) DCPD-BX in this resin varnish composition contain a saturated multi-cyclic structure of dicyclopentadiene, the resin varnish shows lower dipole, dielectric constant (Dk), dissipation factor (Df) and moisture absorption; and via adding a brominated or phosphorus flame retardant, the composition exhibits high thermal stability characteristic. The copper clad laminates obtained in accordance with the invention meet not only the demand of low dielectric constant (Dk<4.0 @ 1 GHz) and low dissipation factor (Df<0.009 @ 1 GHz), but also possesses high heat stability and low moisture absorption characteristics, thus are widely applied to high-performance electronic materials.