Provided is a silver-coated copper powder which can be utilized as an electrically conductive paste and an electromagnetic wave shield. A silver-coated copper powder has a dendritic shape having a linearly grown main stem and a plurality of branches separated from the main stem, the main stem and the branches are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 μm to 5.0 μm to be determined by scanning electron microscopic (SEM) observation gather, the surface of the copper particles is coated with silver, the average particle diameter (D50) of the silver-coated copper powder 1 is from 1.0 μm to 100 μm, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.
本发明提供了一种可用作导电浆料和电磁波屏蔽层的镀
银铜粉。镀
银铜粉呈树枝状,具有线状生长的主茎和从主茎分离出来的多个分支,主茎和分支构成平板状
铜颗粒,其横截面平均厚度为 0.02 μm 至 5.0 μm,由扫描电子显微镜(
SEM)观察聚集确定,
铜颗粒表面镀有
银,镀
银铜粉 1 的平均颗粒直径(D50)为 1.0 μm 至 100 μm,相对于
铜颗粒的平板形表面的垂直方向上的最大高度为
铜颗粒的平板形表面的
水平方向上的最大长度的 1/10 或以下。