2-vinylmethyl-4,6-amino-1,3,5triazine

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 英文名称: 2-vinylmethyl-4,6-amino-1,3,5triazine
• 英文别名: 1,3,5-Triazine-2,4-diamine, 6-(2-propenyl)-；6-prop-2-enyl-1,3,5-triazine-2,4-diamine
• 化学式: C₆H₉N₅
• mdl: MFCD04067217
• 分子量: 151.171
• InChiKey: GTULHXHKEHMLOC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.4
• 重原子数：
  11
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.166
• 拓扑面积：
  90.7
• 氢给体数：
  2
• 氢受体数：
  5

反应信息

• 作为反应物：
  描述：

  三乙氧基硅烷 、 2-vinylmethyl-4,6-amino-1,3,5triazine 在 铂 作用下， 生成 2-triethoxysilylpropyl-4,6-amino-1,3,5-triazine
  参考文献：
  名称：

  CN112174998

  摘要：

  公开号：

文献信息

• Compositions of matter having bioactive properties
  申请人：Schmitz, Robert A.

  公开号：EP1288238A1

  公开（公告）日：2003-03-05

  Particles of coordinated complex comprising a basic, hydrous polymer and a capacitance adding compound, as well as methods for their production, are described. These complexes exhibit a high degree of bioactivity making them suitable for a broad range of applications through their incorporation into conventional vehicles benefiting from antimicrobial and similar properties.

  描述了由基础水合聚合物和电容添加化合物组成的协调复合物的颗粒，以及它们的生产方法。这些复合物表现出很高的生物活性，使它们适用于广泛的应用领域，通过将它们纳入传统载体中，从而受益于抗菌和类似性能。
• Expandierbare Styrolpolymerisate
  申请人：BASF Aktiengesellschaft

  公开号：EP0395981A1

  公开（公告）日：1990-11-07

  Expandierbare Styropolymerisate, die einen C₃-C₆-Kohlenwasserstoff als Treibmittel, eine organische Bromverbindung als Flammschutzmittel und geringe Mengen eines Ammoniumsalzes und eines organischen Amins enthalten, liefern beim Expandieren Schaumstoffe, die sich durch eine besonders homogene Schaumstruktur und eine hohe Wärmedämmwirkung auszeichnen.

  可发泡苯乙烯聚合物含有作为发泡剂的 C₃-C₆ 碳氢化合物、作为阻燃剂的有机溴化合物以及少量铵盐和有机胺，在发泡过程中产生的泡沫具有泡沫结构特别均匀和隔热效果好的特点。
• THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2412743A1

  公开（公告）日：2012-02-01

  A thermosetting resin composition containing: (A) a resin composition having an unsaturated Maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.

  一种热固性树脂组合物，含有(A) 一种具有不饱和马来酰亚胺基团的树脂组合物，该树脂组合物是由(a) 一种马来酰亚胺化合物和(b) 一种胺化合物在有机溶剂中反应生成的，前者每分子至少具有两个N-取代马来酰亚胺基团，后者每分子至少具有两个伯氨基；(B) 热固性树脂；以及 (C) 改性咪唑化合物，如异氰酸酯掩蔽咪唑和环氧树脂掩蔽咪唑，以及预浸料、带支架的绝缘膜、层压板和印刷线路板，每种材料都含有相同的成分。
• MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP2666804A1

  公开（公告）日：2013-11-27

  There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device.

  本发明提供了一种通过以下反应制备的改性有机硅化合物：(A)通式(1)表示的硅氧烷二胺；(B)分子结构中含有至少两个 N-取代马来酰亚胺基团的马来酰亚胺化合物；以及(C)具有酸性取代基的胺化合物；还提供了一种通过使用该化合物形成的热固性树脂组合物、预浸料、层压板和印刷线路板。使用由改性硅化合物和本发明的热固性树脂组合物制成的预浸料通过层压模塑形成的层压板生产的多层印刷线路板具有优异的玻璃化温度、热膨胀系数、铜箔粘附性、吸湿性、吸湿焊锡耐热性和铜粘焊锡耐热性。因此，这种多层印刷线路板可用作高度集成的半导体封装和电子设备的印刷线路板。
• Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
  申请人：Hitachi Chemical Company, Ltd.

  公开号：US10119047B2

  公开（公告）日：2018-11-06

  A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.

  一种热固性树脂组合物，含有(A) 具有不饱和马来酰亚胺基团的树脂组合物，该树脂组合物是由(a)马来酰亚胺化合物和(b)胺化合物在有机溶剂中反应制得的，马来酰亚胺化合物每分子至少具有两个N-取代马来酰亚胺基团，胺化合物每分子至少具有两个伯氨基；(B) 热固性树脂；以及 (C) 改性咪唑化合物，如异氰酸酯掩蔽咪唑和环氧树脂掩蔽咪唑，以及预浸料、带支架的绝缘膜、层压板和印刷线路板，每种材料都含有相同的成分。