Yttrium oxide films are deposited on silicon using a new precursor, tris(ethylcyclopentadienyl) yttrium with water vapor as the oxidizer, by means of atomiclayerdeposition (ALD). Film growth kinetics has been examined under different reactor conditions, and growth saturation is evident from precursor dosage dependence. The film thickness increases linearly with the number of deposition cycles, yielding
通过原子层沉积 (ALD),使用新的前体三(乙基环戊二烯基)钇和水蒸气作为氧化剂在硅上沉积氧化钇膜。薄膜生长动力学已经在不同的反应器条件下进行了检查,并且生长饱和从前体剂量依赖性是显而易见的。薄膜厚度随沉积循环次数线性增加,在最佳 ALD 条件下产生 1.7 ± 0.1 A/循环的增长率。将反应器温度从 200°C 提高到 400°C,生长速率逐渐增加,在 250-285°C 范围内有一个狭窄的温度平台。Y 2 O 3 薄膜的 X 射线光电子能谱分析表明薄膜是化学计量的,没有碳污染的迹象,