Trioctylphosphanium;bromide

• 分子结构分类: 有机化合物 - 有机磷化合物
• 英文名称: Trioctylphosphanium;bromide
• 英文别名: trioctylphosphanium;bromide
• 化学式: C24H52BrP
• 分子量: 451.5
• InChiKey: XGBNFIXISYGBKE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  10.13
• 重原子数：
  26
• 可旋转键数：
  21
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  0
• 氢给体数：
  1
• 氢受体数：
  0

文献信息

• Prüfmittel zum Nachweis kuppelnder Verbindungen sowie ein Verfahren zu seiner Herstellung
  申请人：BEHRINGWERKE Aktiengesellschaft

  公开号：EP0041683A1

  公开（公告）日：1981-12-16

  Es wird ein Prüfmittel zum Nachweis kuppelnder Verbindungen in Flüssigkeiten beschrieben, das im wesentlichen aus einer adsorbierenden Matrix besteht, die das Diazoniumsalz als Reagenz enthält und einen Stabilisator für dieses Diazoniumsalz enthält, wobei der Stabilisator ein Phosphoniumsalz ist. Es wird weiterhin ein Verfahren zur Herstellung eines solchen Prüfmittels angegeben.

  描述了一种用于检测液体中偶联化合物的测试剂，它主要由含有重氮盐试剂的吸附基质和重氮盐的稳定剂（稳定剂为鏻盐）组成。还进一步公开了制备这种检测剂的方法。
• Circuit board using low dielectric resin composition
  申请人：Zhen Ding Technology Co., Ltd.

  公开号：US11261328B2

  公开（公告）日：2022-03-01

  A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

  一种电路板包括由低介电树脂组合物制成的绝缘层，低介电树脂组合物包括含酸酐的低介电树脂、环氧树脂、含乙烯基和活性酯的聚苯醚树脂、马来酸液态聚丁二烯和促进剂。与不含酸酐的低电介质树脂相比，这种低电介质树脂更容易溶解在有机溶剂中，与不含酸酐的低电介质树脂相比，含酸酐的低电介质树脂与其他有机成分的相容性更好。因此，可以获得介电常数更低、性能更好的低介电树脂组合物。
• LOW DIELECTRIC RESIN COMPOSITION, FILM AND CIRCUIT BOARD USING THE SAME
  申请人：Zhen Ding Technology Co., Ltd.

  公开号：US20180265699A1

  公开（公告）日：2018-09-20

  A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.
• CIRCUIT BOARD USING LOW DIELECTRIC RESIN COMPOSITION
  申请人：Zhen Ding Technology Co., Ltd.

  公开号：US20210102067A1

  公开（公告）日：2021-04-08

  A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.