In order to polish a wiring metal, a polishing composition ensuring that etching and erosion are suppressed and the residual wiring metal on the portion other than wiring is decreased, is provided, in which a polishing composition comprising (A) an azole group-containing compound having 3 or more azole groups within the molecule and a molecular weight of 300 to 15,000, (B) an oxidant, and (C) one, two or more acids selected from the group consisting of an amino acid, an organic acid and an inorganic acid is provided.
为了抛光配线
金属,提供了一种抛光组合物,可确保抑制蚀刻和侵蚀,并减少配线以外部分的残余配线
金属,其中抛光组合物由以下部分组成:(A) 分子中含有 3 个或 3 个以上唑基且分子量在 300 至 15,000 之间的含唑基化合物;(B) 氧化剂;以及 (C) 一种、两种或两种以上从
氨基酸、有机酸和
无机酸组成的组中选出的酸。