申请人:Dershem Stephen M
公开号:US20130012620A1
公开(公告)日:2013-01-10
The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset.
本发明涉及环氧树脂的硬化剂,以及含有经相同制备方法固化的这种树脂的组合物(例如胶粘剂)及其用途。更具体地,本发明涉及用于环氧树脂的混合硬化剂,包括芳香胺、酚和/或苯酯基团。本发明的另一个方面涉及具有优异固化潜伏期和低固化温度起始点的新咪唑催化剂。