3-Hydroxyphenyl 2-methylbenzoate

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 缩酚酸和缩酚酸环醚类
• 英文名称: 3-Hydroxyphenyl 2-methylbenzoate
• 英文别名: (3-hydroxyphenyl) 2-methylbenzoate
• 化学式: C₁₄H₁₂O₃
• 分子量: 228.24
• InChiKey: ZFDNVMBKXNZZEQ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4
• 重原子数：
  17
• 可旋转键数：
  3
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.07
• 拓扑面积：
  46.5
• 氢给体数：
  1
• 氢受体数：
  3

文献信息

• Heat-Sensitive Adhesive and Heat-Sensitive Adhesive Material
  申请人：Ricoh Company, Ltd.

  公开号：EP2072597A1

  公开（公告）日：2009-06-24

  The present invention provides a heat-sensitive adhesive containing at least a thermoplastic resin, a solid plasticizer, and an adhesion-imparting agent, wherein the adhesion-imparting agent is an adhesion-imparting agent emulsion which is prepared by emulsifying in the presence of a polymeric emulsifier.

  本发明提供了一种热敏粘合剂，至少含有一种热塑性树脂、一种固体增塑剂和一种附着力引发剂，其中附着力引发剂是一种附着力引发剂乳液，它是在聚合物乳化剂存在下通过乳化制备的。
• Thermosensitive adhesive material
  申请人：Ricoh Company, Ltd.

  公开号：EP2014688B1

  公开（公告）日：2012-05-30
• Heat-sensitive adhesive material
  申请人：Ricoh Company, Ltd.

  公开号：EP2397531B1

  公开（公告）日：2012-10-31
• THERMOSENSITIVE ADHESIVE MATERIAL
  申请人：SHIMBO Hitoshi

  公开号：US20090017299A1

  公开（公告）日：2009-01-15

  An object of the present invention is to provide a thermosensitive adhesive material which is superior in blocking resistance when not active and which has adequate adhesion in a wide temperature range to a target with little smoothness such as corrugated fiberboard. Specifically, the present invention relates to a thermosensitive adhesive material including a support, and a thermosensitive adhesive layer provided on one surface of the support, the thermosensitive adhesive layer containing as essential components a thermoplastic resin and a hot-melt material that melts when heated, wherein the thermoplastic resin contains as a main component a (meth)acrylic copolymer in which acrylonitrile, a monomer component, occupies 5% by mass to 20% by mass of all monomer components, and wherein the glass transition temperature of the copolymer is in the range of −70° C. to −30° C.
• HEAT-SENSITIVE ADHESIVE, AND HEAT-SENSITIVE ADHESIVE MATERIAL
  申请人：Yamaguchi Takehito

  公开号：US20090155569A1

  公开（公告）日：2009-06-18

  The present invention provides a heat-sensitive adhesive containing at least a thermoplastic resin, a solid plasticizer, and an adhesion-imparting agent, wherein the adhesion-imparting agent is an adhesion-imparting agent emulsion which is prepared by emulsifying in the presence of a polymeric emulsifier.