[Technical Problem]
To provide copper particulate dispersion capable of forming a conductive film having favorable adhesiveness on an inorganic substrate by photo-sintering.
[Solution to Problem]
The copper particulate dispersion 1 includes a dispersion vehicle and copper particulates 11. The copper particulates 11 are dispersed into the dispersion vehicle. The copper particulate dispersion 1 includes an adhesion improvement agent for improving adhesiveness between a conductive film 4 formed on a substrate by photo-sintering the copper particulate 11 and the substrate. The substrate is an inorganic substrate 3. The adhesion improvement agent is a compound containing a phosphorus atom. Thus, the adhesion improvement agent improves adhesiveness between the conductive film 4 and the inorganic substrate 3.
[技术问题]
提供能够通过光烧结在无机基底上形成具有良好粘附性的导电膜的
铜微粒分散体。
[问题解决方案]
铜微粒分散液 1 包括分散载体和
铜微粒 11。
铜微粒 11 被分散到分散载体中。
铜微粒分散液 1 包括一种附着力改善剂,用于改善通过光烧结
铜微粒 11 在基底上形成的导电膜 4 与基底之间的附着力。基底是无机基底 3。附着力改进剂是一种含有
磷原子的化合物。因此,附着力改进剂可提高导电膜 4 和无机基底 3 之间的附着力。