Chemical amplification type positive photosensitive resin composition, a photosensitive dry film, a method for producing a photosensitive dry film, a method for producing a patterned resist film, a method of manufacturing a template with a substrate, and a method of manufacturing a plated shaped product, and a Mercapto compound
申请人:TOKYO OHKA KOGYO CO., LTD.
公开号:US11061326B2
公开(公告)日:2021-07-13
A chemically amplified positive-type photosensitive resin composition capable of suppressing the occurrence of “footing” in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than the top (the side proximal to the surface of a resist layer) in the nonresist portion when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate having a metal surface using the composition. A mercapto compound having the formula (C) shown below is added to the composition and includes an acid generator which generates acid upon exposure to an irradiated active ray or radiation and a resin the solubility of which in alkali increases under the action of acid:
wherein n1, n2, Rc1, and Rc are defined in claim 1.
一种化学放大正型光敏树脂组合物,当使用该组合物在具有金属表面的基板的金属表面上形成作为电镀物品模板的抗蚀图案时,能够抑制非抗蚀部分底部(靠近支撑物表面的一面)的宽度比顶部(靠近抗蚀层表面的一面)窄的 "起脚 "现象的发生。在组合物中加入具有下图所示式(C)的巯基化合物,该化合物包括一种酸发生器和一种树脂,前者在受到辐照活性射线或辐射时产生酸,后者在酸的作用下在碱中的溶解度增加:
其中 n1、n2、Rc1 和 Rc 在权利要求 1 中定义。