The present invention describes new types of metal complexes. Such compounds can be used as functional materials in a series of different types of applications which can be classified within the electronics industry in the widest sense.
The inventive compounds are described by the formulae (1) and (4).
本发明描述了新型
金属配合物。这些化合物可以用作功能材料,在广义上可归类为电子工业中的一系列不同类型的应用。创新化合物由公式(1)和(4)描述。