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2-Ethyl-1,2-oxaphosphorinan-2-oxid | 15096-29-4

中文名称
——
中文别名
——
英文名称
2-Ethyl-1,2-oxaphosphorinan-2-oxid
英文别名
2-Ethyl-2-oxo-1-oxa-2-phosphorinan;2-ethyl-[1,2]oxaphosphinane 2-oxide;2-Ethyl-1,2lambda5-oxaphosphinane 2-oxide;2-ethyl-1,2λ5-oxaphosphinane 2-oxide
2-Ethyl-1,2-oxaphosphorinan-2-oxid化学式
CAS
15096-29-4
化学式
C6H13O2P
mdl
——
分子量
148.142
InChiKey
QYXLMNWNBUUTCC-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 沸点:
    94-95 °C(Press: 1 Torr)
  • 密度:
    1.1211 g/cm3

计算性质

  • 辛醇/水分配系数(LogP):
    0.3
  • 重原子数:
    9
  • 可旋转键数:
    1
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    1.0
  • 拓扑面积:
    26.3
  • 氢给体数:
    0
  • 氢受体数:
    2

反应信息

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文献信息

  • Pudovik,A.N. et al., Journal of general chemistry of the USSR, 1967, vol. 37, p. 428 - 431
    作者:Pudovik,A.N. et al.
    DOI:——
    日期:——
  • LIQUID CRYSTALLINE THERMOSET OLIGOMER OR POLYMER AND THERMOSETTING COMPOSITION AND SUBSTRATE INCLUDING THE SAME
    申请人:LEE Jae-Jun
    公开号:US20110232944A1
    公开(公告)日:2011-09-29
    A liquid crystalline thermoset oligomer or polymer including a structural unit of Chemical Formulae 1 and 2; and a functional group of Chemical Formula A,
  • RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD INCLUDING THE SAME
    申请人:LEE Keun Yong
    公开号:US20130098666A1
    公开(公告)日:2013-04-25
    There is provided a resin composition for a printed circuit board, including 100 parts by weight of a liquid crystal oligomer shown in a predetermined Formula; and 10 to 40 parts by weight of a rubber-modified epoxy resin.
  • RESIN COMPOSITION FOR THERMAL RADIATION BOARD AND THERMAL RADIATION BOARD COMPRISING THE SAME
    申请人:SAMSUNG ELECTRO-MECHANICS CO., LTD.
    公开号:US20140063427A1
    公开(公告)日:2014-03-06
    There is provided a resin composition for a thermal radiation board including: 20 wt % to 50 wt % of a liquid crystal oligomer represented by particular Chemical Formulas; 10 wt % to 40 wt % of an epoxy resin; and 10 wt % to 40 wt % of an inorganic filter.
  • RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD COMPRISING THE SAME
    申请人:Samsung Electro-Mechanics Co., Ltd.
    公开号:US20150147542A1
    公开(公告)日:2015-05-28
    A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured.
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