Phosphorsaeure-propylester-bis-<2,3-epoxy-propylester> | 17167-39-4

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 有机磷酸及其衍生物
• 英文名称: Phosphorsaeure-propylester-bis-<2,3-epoxy-propylester>
• 英文别名: Phosphoric acid, bis(oxiranylmethyl) propyl ester；bis(oxiran-2-ylmethyl) propyl phosphate
• CAS: 17167-39-4
• 化学式: C₉H₁₇O₆P
• 分子量: 252.204
• InChiKey: DFYQRFUGSMMBTG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.2
• 重原子数：
  16
• 可旋转键数：
  9
• 环数：
  2.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  69.8
• 氢给体数：
  0
• 氢受体数：
  6

文献信息

• Aluminum Phosphorus Acid Salts as Epoxy Resin Cure Inhibitors
  申请人：TIMBERLAKE LARRY D.

  公开号：US20120296013A1

  公开（公告）日：2012-11-22

  Certain aluminum salts of organic phosphorus acids are found to have a strong effect on inhibiting the epoxy cure rate in epoxy formulations. The substances act catalytically and can be used at a low level in an epoxy formulation to adjust the reactivity of a resin formulation to give longer gel times. Compositions and methods of preparing and using the compositions are disclosed.

  某些有机磷酸铝盐发现对于抑制环氧配方中的环氧固化速率具有强烈的影响。这些物质具有催化作用，可以在环氧配方中的低水平使用，以调整树脂配方的反应性，从而延长凝胶时间。公开了组成物和制备和使用组成物的方法。
• Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：US10178767B2

  公开（公告）日：2019-01-08

  An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).

  本发明的目的是提供一种树脂组合物，该树脂组合物具有印刷电路板材料所需的各种性能，例如高阻燃性，并能获得具有高成型性、在脱墨步骤中具有高抗化学性和小热膨胀系数的固化产品；提供一种包含该树脂组合物的预浸料；提供一种包含该预浸料的层压板；提供一种包含该预浸料的金属箔包覆层压板；以及提供一种包含该预浸料的印刷电路板。一种树脂组合物，包括丙烯酸-硅氧烷共聚物（A）、无卤环氧树脂（B）、氰酸酯化合物（C）和/或酚醛树脂（D）以及无机填料（E）。
• Flame retardant phosphorus element-containing epoxy resin compositions
  申请人：——

  公开号：US20020119317A1

  公开（公告）日：2002-08-29

  A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: (I) a non-halogenated epoxy resin material selected from: (A) a non-halogenated phosphorus element-containing epoxy resin; (B) a mixture of: (1) a non-halogenated, non-phosphorus element-containing epoxy resin, and (2) a phosphorus element-containing compound; or (C) the reaction product of: (1) a non-halogenated epoxy resin; and (2) a phosphorus element-containing compound; or (D) a combination of two or more of components (A) to (C); and (II) (A) a multi-functional phenolic crosslinking agent having a hydroxy functionality of at least 2; (B) a material which forms a multifunctional phenolic crosslinking agent having a hydroxy functionality of at least 2, upon heating or (C) a mixture of components (A) and (B); in an amount of from about 50% to about 150% of the stoichiometric amount needed to cure the epoxy resin. Electrical laminate circuit boards having reduced flammability may be made from these compositions.

  一种阻燃性含磷元素环氧树脂组合物，基本上不含卤素，包括 (I) 选自以下材料的无卤环氧树脂材料 (A) 无卤素含磷环氧树脂； (B) 以下物质的混合物 (1) 无卤素、不含磷元素的环氧树脂，和 (2) 含磷元素化合物；或 (C) 以下物质的反应产物 (1) 非卤化环氧树脂；和 (2) 含磷元素化合物；或 (D) 成分(A)至(C)中兩個或以上的組合；及 (II) (A) 具有至少 2 个羟基官能度的多功能酚醛交联剂；(B) 在加热时形成 具有至少 2 个羟基官能度的多功能酚醛交联剂的材料；或 (C) 成分(A)和(B)的混合物；其用量为固化环氧树脂所需的化学计量 量的约 50%至约 150%。用这些成分可制成易燃性降低的电气层压电路板。
• Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
  申请人：——

  公开号：US20030031873A1

  公开（公告）日：2003-02-13

  A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: (I) a non-halogenated epoxy resin material selected from: (A) a non-halogenated phosphorus element-containing epoxy resin; (B) a mixture of: (1) a non-halogenated, non-phosphorus element-containing epoxy resin, and (2) a phosphorus element-containing compound; or (C) the reaction product of: (1) a non-halogenated epoxy resin; and (2) a phosphorus element-containing compound; or (D) a combination of two or more of components (A) to (C); and (II) (A) a multi-functional phenolic crosslinking agent having a hydroxy functionality of at least 2; (B) a material which forms a multifunctional phenolic crosslinking agent having a hydroxy functionality of at least 2, upon heating or (C) a mixture of components (A) and (B); in an amount of from about 50% to about 150% of the stoichiometric amount needed to cure the epoxy resin. Electrical laminate circuit boards having reduced flammability may be made from these compositions.

  一种阻燃性含磷元素环氧树脂组合物，基本上不含卤素，包括 (I) 选自以下材料的无卤环氧树脂材料 (A) 无卤素含磷环氧树脂； (B) 以下物质的混合物 (1) 无卤素、不含磷元素的环氧树脂，和 (2) 含磷元素化合物；或 (C) 以下物质的反应产物 (1) 非卤化环氧树脂；和 (2) 含磷元素化合物；或 (D) 成分(A)至(C)中兩個或以上的組合；及 (II) (A) 具有至少 2 个羟基官能度的多功能酚醛交联剂；(B) 在加热时形成 具有至少 2 个羟基官能度的多功能酚醛交联剂的材料；或 (C) 成分(A)和(B)的混合物；其用量为固化环氧树脂所需的化学计量 量的约 50%至约 150%。用这些成分可制成可燃性降低的电气层压电路板。
• Halogen free ignition resistant thermoplastic resin compositions
  申请人：Gan Joseph

  公开号：US20050239975A1

  公开（公告）日：2005-10-27

  The present invention is a halogen-free ignition resistant polymer composition comprising: A) a thermoplastic polymer, and B) a phosphorus element-containing epoxy resin.

  本发明是一种无卤素耐燃聚合物组合物，包括A) 热塑性聚合物，和 B) 含磷元素的环氧树脂。