lambda~2~-Stannane--silver (1/3) | 12041-38-2

• 分子结构分类: 无机化合物 - 混合金属/非金属化合物 - 各种混合金属/非金属
• 英文名称: lambda~2~-Stannane--silver (1/3)
• 英文别名: λ2-stannane;silver
• CAS: 12041-38-2
• 化学式: Ag₃Sn
• 分子量: 442.315
• InChiKey: GZIOHNBKDMFQDA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.92
• 重原子数：
  4.0
• 可旋转键数：
  0.0
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  0.0
• 氢给体数：
  0.0
• 氢受体数：
  0.0

反应信息

• 作为反应物：
  描述：

  lambda~2~-Stannane--silver (1/3) 、 汞 以 neat (no solvent) 为溶剂， 生成 Mercury;silver
  参考文献：
  名称：

  Laboda, S., Kohaszati Lapok, 1965, vol. 98, p. 260 - 266

  摘要：

  DOI：
• 作为产物：
  描述：

  tin 、 银 以 neat (no solvent, solid phase) 为溶剂， 生成 lambda~2~-Stannane--silver (1/3)
  参考文献：
  名称：

  锂离子电池用新型银锡合金负极材料

  摘要：

  通过机械合金化技术制备的Ag-Sn合金已被研究作为锂离子电池的负极材料。通过优化的成分和结构形态，Ag 52 Sn 48 和 Ag 46 Sn 54 复合电极均表现出约 800 mAh/g 的初始容量，并在超过 50 次循环后保持高于 350 mAh/g 的可逆容量。即使经过 300 次循环，前者仍保持约 200 mAh/g 的可逆容量。通常，通过 X 射线衍射分析检查伴随锂嵌入/脱嵌过程的 Ag 52 Sn 48 电极的结构变化。结果表明，由 β-Sn 和 Ag 3 Sn 相组成的复合合金在 Li 嵌入过程中主要转变为三元锂化相，并恢复为包含 β-Sn、Ag 3 Sn、Li提取后残留的Ag 2 LiSn相。认为在第一次循环中形成的包含三元锂化相的复合结构有利于提高 Ag-Sn 合金电极的循环寿命，尽管残留的锂化产物可能导致不可逆转的损失。

  DOI：

  10.1149/1.1590326

文献信息

• New Ag-Sn Alloy Anode Materials for Lithium-Ion Batteries
  作者：Jingtian Yin、Masashi Wada、Seiji Yoshida、Kouji Ishihara、Shigeo Tanase、Tetsuo Sakai

  DOI：10.1149/1.1590326

  日期：——

  The Ag-Sn alloys prepared by mechanical alloying technique have been studied as negative electrode materials for lithium-ion batteries. With optimized compositions and structure morphologies, both Ag 52 Sn 48 and Ag 46 Sn 54 composite electrodes exhibit an initial capacity of ∼800 mAh/g and maintain a reversible capacity of above 350 mAh/g for more than 50 cycles. Even after 300 cycles, the former

  通过机械合金化技术制备的Ag-Sn合金已被研究作为锂离子电池的负极材料。通过优化的成分和结构形态，Ag 52 Sn 48 和 Ag 46 Sn 54 复合电极均表现出约 800 mAh/g 的初始容量，并在超过 50 次循环后保持高于 350 mAh/g 的可逆容量。即使经过 300 次循环，前者仍保持约 200 mAh/g 的可逆容量。通常，通过 X 射线衍射分析检查伴随锂嵌入/脱嵌过程的 Ag 52 Sn 48 电极的结构变化。结果表明，由 β-Sn 和 Ag 3 Sn 相组成的复合合金在 Li 嵌入过程中主要转变为三元锂化相，并恢复为包含 β-Sn、Ag 3 Sn、Li提取后残留的Ag 2 LiSn相。认为在第一次循环中形成的包含三元锂化相的复合结构有利于提高 Ag-Sn 合金电极的循环寿命，尽管残留的锂化产物可能导致不可逆转的损失。
• Chemistry and structural chemistry of phosphides and polyphosphides 51
  作者：E. Gmelin、W. Hönle、Ch. Mensing、H. G. von Schnering、K. Tentschev

  DOI：10.1007/bf01911915

  日期：1989.11
• Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn–Ag–Cu solders on Cu substrates
  作者：Yue Gu、Xiuchen Zhao、Yi Li、Ying Liu、Yong Wang、Zhenyu Li

  DOI：10.1016/j.jallcom.2014.12.024

  日期：2015.4

  In the present study, Fe2O3 nanoparticles were synthesized and smelted with pure Sn, Ag, and Cu to prepare Sn-1.0Ag-0.7Cu-xFe(2)O(3) nano-composite solders. The content of Fe2O3 nanoparticles ranged from 0 to 1 wt.% in the solders. The influences of Fe2O3 nanoparticles on the wettability and the morphology of interfacial intermetallics compounds (IMCs) of low-Ag Sn-Ag-Cu solders on Cu substrate were investigated. Results show that added Fe2O3 nanoparticles can remarkably improve the wettability of Sn-1.0Ag-0.7Cu solder alloys and inhibit the formation and the growth of the interfacial IMCs between the nano-composite solders and Cu substrate. Meanwhile, not only the wettability of the nano-composite solders but also the formation and the growth of the interfacial IMCs, during reflow and aging, are identically relied on Fe2O3 weight percent in nano-composite solders. The enhancement of wettability improvement and interfacial IMC inhibition caused by nano-Fe2O3 addition increased with the addition amount under small concentration. However, excessive addition of Fe2O3 nanoparticles in the Sn-1.0Ag-0.7Cu solder alloys will degrade the wettability and the inhibition effect on the interfacial IMCs. There is an optimum amount of Fe2O3 nanoparticles in Sn-1.0Ag-0.7Cu solder alloys, which is 0.4 wt.%, and Sn-1.0Ag-0.7Cu-0.4Fe(2)O(3) solders possess the best wettability and the inhibition effect on the interfacial IMCs formation and growth. The reason for improving wettability and simultaneously inhibiting IMCs formation and growth due to Fe2O3 nanoparticles addition is explained. (C) 2014 Elsevier B.V. All rights reserved.
• Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds
  作者：H. Flandorfer、U. Saeed、C. Luef、A. Sabbar、H. Ipser

  DOI：10.1016/j.tca.2007.04.004

  日期：2007.7

  Standard enthalpies of formation were determined for a number of binary intermetallic compounds in the systems Ag-Sn, Cu-Sn, and Ni-Sn by means of solution calorimetry in liquid Sn in a Calvet-type microcalori meter. For the pure elements Ag, Cu, and Ni, the limiting partial enthalpies of mixing as well as the enthalpies of solution at infinite dilution in Sn were measured at 773, 873, 973 and 1073 K. The results for the enthalpy of formation for the intermetallic compounds Ag3Sn, Ag4Sn, Cu3Sn, Cu41Sn11, Cu6Sn5, Ni3Sn-LT, Ni3Sn2-HT, and Ni3Sn4 are discussed and compared with the corresponding literature values. (c) 2007 Elsevier B.V. All rights reserved.
• Possibility of and conditions for the room temperature formation of compounds at the bulk metal/thin metal film interface
  作者：V. Simić、Ž. Marinković

  DOI：10.1016/0022-5088(83)90519-2

  日期：1983.12