申请人:Masatoki Tamiharu
公开号:US20070131141A1
公开(公告)日:2007-06-14
There is disclosed is a method comprising surface-processing a Sn based, Sn alloy based or Sn—Zn alloy based solder particle (
1
), applied as a coating, such as by electrical plating or melt plating, to the surface of a metal material, such as iron, a steel plate or copper, with a phosphate and a silicium containing compound, to form a protective film (
2
). There are also disclosed a solder material (
6
) in which a protective film (
2
) formed of a phosphate and a silicium containing compound is formed on the surface of the Sn—Zn based solder particle (
1
), and a solder paste formed of this solder material (
6
) and the flux.