Phosphorus triamides or their polymers are described as phosphorus dopants adapted to be spun-on to a semiconductor substrate and used in integrated circuit manufacture. Sheet resistivities of 4 to 13 ohms per square are obtained at low weight loadings in 1 hour, 1000°C diffusions.
The polymer (or monomers), are homogeneous and soluble and are easily distributed uniformly on the semicon- ` ductor surface, such as by the spin-on method; are relatively non-volatile so that when the solvent is removed and the material heated to diffusion temperatures, the desired film will be substantially intact; and are capable of being rendered insoluble, i.e. crosslinked thermally or otherwise, and are characterized as glassy rather than crystalline.
The polymeric solution may be employed in the manufacture of semiconductor components and, as such, the solution may be spun-on silicon wafers to function as a phosphorus impurity source (dopant) in thermal diffusions. Such doped wafers are then used in integrated circuit manufacture.
磷三酰胺或其聚合物被描述为
磷掺杂剂,适用于纺到半导体基片上,并用于集成电路制造。在 1000°C 的扩散温度下,1 小时的低重量负载可获得每平方 4 至 13 欧姆的片状电阻。
聚合物(或单体)是均匀的、可溶的,很容易均匀地分布在半导体导管表面上,例如通过旋涂法;相对不易挥发,因此当去除溶剂并将材料加热到扩散温度时,所需的薄膜将基本完好无损;并且能够使其不溶解,即通过热或其他方式交联,其特点是
玻璃状而非结晶状。
该聚合物溶液可用于制造半导体元件,因此,该溶液可纺在
硅晶片上,在热扩散中用作
磷杂质源(掺杂剂)。这种掺杂
硅片可用于集成电路制造。