Reactivity of Intermetallic Compounds: A Solid State Approach to Direct Reactions of Silicon
作者:Jörg Acker、Klaus Bohmhammel
DOI:10.1021/jp0130315
日期:2002.5.1
work is focused on a new approach to describe, quantify, and compare the reactivity of various transition metal silicide phases toward hydrogen chloride. Thermodynamic and kinetic parameters are obtained from isothermal calorimetric studies of these reactions. The reactivity of the silicide phases is discussed in terms of reaction start temperatures, rate constants, and apparent activation energies. Negative
Phase relationships in the La–Ni–Si system at 673 K
作者:Huaiying Zhou、Qingrong Yao、Songliu Yuan、Jingqi Liu、Heixia Deng
DOI:10.1016/s0925-8388(03)00698-4
日期:2004.3
The phase relationships in the La–Ni–Si ternarysystem at 673 K were investigated by X-ray diffraction (XRD), differential thermal analysis (DTA), scanning electron microscopy (SEM) and electron probe microanalysis (EPMA). All phase relationships were studied at 673 K. At this temperature, the existence of 14 ternarycompounds has been confirmed. This section consists of 35 single-phase regions, 78
摘要 通过 X 射线衍射 (XRD)、差热分析 (DTA)、扫描电子显微镜 (SEM) 和电子探针微量分析 (EPMA) 研究了 673 K 下 La-Ni-Si 三元体系中的相关系。所有的相关系都是在 673 K 下研究的。在这个温度下,已经确认了 14 种三元化合物的存在。该部分由35个单相区、78个二相区和47个三相区组成。在 673 K 时,Si 在 Ni、La 2 Ni 7 、LaNi 5 和 La 2 NiSi 中的最大固溶度分别约为 9、3、8.33 和 5 at.%。几种三元化合物形成一个均质区,可以表示为 LaNi 11.6–9.5 Si 1.4–3.5 、LaNi 8.8–8.4 Si 4.2–4.6 和 LaNi 7.8–6.5 Si 5.2–6.5 。
The electronic structure of NiAl and NiSi
作者:D D Sarma、W Speier、R Zeller、E van Leuken、R A de Groot、J C Fuggle
DOI:10.1088/0953-8984/1/46/007
日期:1989.11.20
the electronicstructure of NiSi and NiAl employing electron spectroscopies and theoretical calculations is presented. Experimental results, obtained with X-ray photoemission and bremsstrahlung isochromat spectroscopy, are interpreted by means of density of states and matrix element calculations for the compounds in their real crystal structure. This gives a detailed picture of the electronic states
介绍了使用电子光谱和理论计算研究 NiSi 和 NiAl 的电子结构。用 X 射线光电子发射和轫致辐射等色光谱获得的实验结果,通过状态密度和基体元素计算来解释化合物的真实晶体结构。这给出了费米能级下方和上方整个键合-反键合区域的电子态的详细图片。基于 NiAl 分子轨道方法的簇计算提供了对各种对称状态的键合特性的进一步了解。作者发现,迄今为止用于硅化物的简单 dp 键合方案需要修改,其中金属 d 状态被称为“非键合”。
Inverse photoemission study of nickel silicides
作者:M. Azizan、R. Baptist、G. Chauvet、T.A. Nguyen Tan
DOI:10.1016/0038-1098(86)90658-7
日期:1986.1
Abstract Nickelsilicides have been prepared in situ and measured by inversephotoemission in the VUV range. With concomitant ultra-violet photoemission spectroscopy, these experiments allow first to locate the positions of the occupied and non occupied bonding, non bonding and antibonding electronic states, which originate from the nickel d and silicon sp electrons when silicide compounds are formed
摘要 硅化镍已被原位制备并通过 VUV 范围内的逆光电发射进行测量。利用伴随的紫外光发射光谱,这些实验首先允许定位占据和未占据键合、非键合和反键合电子态的位置,这些电子态起源于形成硅化物时的镍 d 和硅 sp 电子,然后进行比较它们具有理论上导出的能量分布曲线。
Formation of NiSi-Silicided p[sup +]n Shallow Junctions Using Implant-Through-Silicide and Low-Temperature Furnace Annealing
作者:Chao-Chun Wang、Chiao-Ju Lin、Mao-Chieh Chen
DOI:10.1149/1.1599851
日期:——
NiSi-silicidedp + nshallowjunctions are fabricated using BF + 2 implantation into/through thin NiSi silicide layer (implant-through-silicide technology) followed by low-temperaturefurnaceannealing (from 550 to 800°C). The NiSi film agglomerates following a thermal annealing at 600°C and may result in the formation of discontinuous islands at a higher temperature. The incorporation of fluorine
NiSi 硅化物 p + n 浅结是使用 BF + 2 注入/穿过薄的 NiSi 硅化物层(注入硅化物技术)然后低温炉退火(从 550 到 800°C)制造的。NiSi 膜在 600°C 下热退火后会结块,并可能导致在较高温度下形成不连续的岛。在NiSi薄膜中掺入氟原子可以延缓薄膜团聚的形成,从而提高薄膜的热稳定性。对于通过 BF + 2 在 35 keV 注入剂量为 5 x 10 15 cm -2 然后进行 650°C 热退火;从 NiSi/Si 界面测量,形成的结约为 60 nm。