1-[3-(2-Hydroxy-butoxy)-phenoxy]-butan-2-ol | 28434-81-3

• 英文名称: 1-[3-(2-Hydroxy-butoxy)-phenoxy]-butan-2-ol
• 英文别名: 1-[3-(2-Hydroxybutoxy)phenoxy]butan-2-ol
• CAS: 28434-81-3
• 化学式: C₁₄H₂₂O₄
• 分子量: 254.326
• InChiKey: KMMUOYGEEKJNDH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.4
• 重原子数：
  18
• 可旋转键数：
  8
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.57
• 拓扑面积：
  58.9
• 氢给体数：
  2
• 氢受体数：
  4

文献信息

• [EN] [(2-ETHOXY-5-TRANS-1-PROPEN-1-YL)-PHENOXYL]-TERMINATED COMPOUNDS<br/>[FR] COMPOSÉS À TERMINAISON [(2-ÉTHOXY-5-TRANS-1-PROPÉN-1-YL)-PHÉNOXYLE]
  申请人：EVONIK TECHNOCHEMIE GMBH

  公开号：WO2017045931A1

  公开（公告）日：2017-03-23

  The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers:, (I) wherein Dis an x-functional group; and x is an integer ≥ 2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及按照式（I）的化合物以及基于聚马来酰亚胺树脂体系的热固性树脂组合物，其中这些化合物作为共聚单体：（I）其中D是一个x官能团；x是大于等于2的整数；但需注意x官能团D不是具有平均摩尔质量在15000克/摩尔至150000克/摩尔范围内的聚碳酸酯。本发明还涉及通过固化这些组合物获得的交联树脂。本发明的化合物可以在结构胶、纤维预浸料的基体树脂、成型复合材料以及结构和/或电气复合材料等领域中使用。
• [EN] THERMOSETTING RESIN COMPOSITIONS<br/>[FR] COMPOSITIONS DE RÉSINE THERMODURCISSABLE
  申请人：HEXCEL COMPOSITES LTD

  公开号：WO2017108946A1

  公开（公告）日：2017-06-29

  Meta and para alkenyl phenols are reacted with hydroxyl benzophenone to produce compounds of the genera formula or which are used as curatives for polymaleimide resins.

  甲基和对烯基酚与羟基苯甲酮反应，产生通式化合物，用作聚马来酰亚胺树脂的固化剂。
• [(2-ETHOXY-5-TRANS-1-PROPEN-1-YL)-PHENOXYL]-TERMINATED COMPOUNDS
  申请人：Evonik Technochemie GmbH

  公开号：EP3144289A1

  公开（公告）日：2017-03-22

  The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as comonomers: wherein D is an x-functional group; and x is an integer ≥ 2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.

  本发明涉及符合式（I）的化合物和以聚马来酰亚胺树脂体系为基础、包含此类化合物作为共聚单体的热固化树脂组合物： 其中 D 是 x-官能团；以及 x 是一个≥ 2 的整数； 但 x-官能团 D 不是平均摩尔质量在 15000 g/mol 至 150000 g/mol 范围内的聚碳酸酯。 本发明还涉及可通过固化此类组合物获得的交联树脂。本发明的化合物可用于结构粘合剂、纤维预浸料基质树脂、模塑化合物以及结构和/或电气复合材料等领域。
• Dimeric Piperidine Derivatives
  申请人：Cik Miroslav

  公开号：US20080015225A1

  公开（公告）日：2008-01-17

  the N-oxide forms, the pharmaceutically acceptable addition salts and the stereochemically isomeric forms thereof, wherein n is 0, 1 or 2; R 2 represents hydroxy; —X— represents C 2-4 alkynyl, C 1-12 alkyl optionally substituted with hydroxy or X represents a divalent radical of the formula wherein; —X 1 — represents C 1-12 alkyl, phenyl or a divalent radical selected from the group consisting of —X 2 — represents C 1-12 alkyl, C 1-4 alkyloxyC 1-4 alkyl, phenyl or a divalent radical of formula —X 3 — represents phenyl or a divalent radical selected from the group consisting of R 1 independently represents hydrogen, C 1-4 alkyl, C 1-4 alkyloxy-, Ar 1 , Ar 2 -carbonyl, Het 1 -C 1-4 alkyl, Het 2 , NR 3 R 4 —C 1-4 alkyl, Ar 3 -C 1-4 alkyloxy- or Het 4 -oxy-; R 3 and R 4 each independently represents hydrogen, C 1-4 alkyl, C 1-4 alkyloxy-, or Het 3 ; Het 1 represents a heterocycle selected from pyridinyl, indolinyl, indolyl, benzimidazolyl, benzthiazolyl, benzisoxazolyl, thiazolyl, pyridinyl, or thiadiazolyl wherein said Het 1 is optionally substituted with one or where possible two or more substituents selected from the group consisting of hydroxy, halo, C 1-4 alkyloxycarbonyl-, C 1-4 alkyl-, C 1-4 alkyloxy- and C 1-4 alkyloxy-substituted with halo; in particular Het 1 represents a heterocycle selected from indolyl or pyridinyl; Het 2 represents a heterocycle selected from indolyl, benzisoxazolyl or oxodiazolyl wherein said Het 2 is optionally substituted with one or where possible two or more substituents selected from the group consisting of hydroxy, halo, C 1-6 alkyl- and C 1-4 alkyloxy-; Het 3 represents a heterocycle selected from benzimidazolyl, benzisoxazolyl or benzthiazolyl wherein said Het 3 is optionally substituted with one or where possible two or more substituents selected from the group consisting of hydroxy, halo, C 1-6 alkyl- and C 1-4 alkyloxy-; in particular Het 3 represents benzthiazolyl substituted with C 1-4 alkyloxy-; Het 4 represents a heterocycle selected from benzimidazolyl, benzisoxazolyl or benzthiazolyl wherein said Het 4 is optionally substituted with one or where possible two or more substituents selected from the group consisting of hydroxy, halo, C 1-6 alkyl- and C 1-4 alkyloxy-; in particular Het 4 represents benzthiazolyl; Ar 1 represents phenyl optionally substituted with halo, C 1-4 alkyl or C 1-4 alkyl substituted with one, two or three halo substituents; Ar 2 represents phenyl optionally substituted with halo, C 1-4 alkyl or C 1-4 alkyl substituted with one, two or three halo substituents; in particular Ar 2 represents phenyl substituted with halo or trifluromethyl; Ar 3 represents phenyl optionally substituted with halo, C 1-4 alkyl or C 1-4 alkyloxy-.