ALUMINUM COMPOUND AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
申请人:Samsung Electronics Co., Ltd.
公开号:US20200207790A1
公开(公告)日:2020-07-02
Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
提供了一种
铝化合物以及使用它制造半导体器件的方法。该
铝化合物可用公式1表示。