A thermoset adhesive for bonding two materials having different linear expansion coefficients with reduced warping and without spaces being formed therebetween. The thermoset adhesive of the present invention comprises an epoxy resin, a core-shell rubber, thermally expansive microparticles, and a curing agent. The thermally expansive microparticles can have at least one or any combination of an average particle size of from 9 to 19 μm, an expansion initiation temperature of from 70 to 100° C., and a maximum expansion temperature of from 110 to 135° C.
一种热固性粘合剂,用于粘合两种线膨胀系数不同的材料,可减少翘曲,且不会在其间形成空隙。本发明的热固性粘合剂由环
氧树脂、芯壳橡胶、热膨胀微粒和固化剂组成。热膨胀微粒子可以具有至少一种或任意组合的平均粒径为 9 至 19 微米,膨胀起始温度为 70 至 100 摄氏度,最大膨胀温度为 110 至 135 摄氏度。