Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.
与传统的液体固化剂相比,本发明公开了既能保持固化材料的物理性能,又能改善潜伏期的液体环氧固化剂。这些液体固化剂可用于固化环氧
树脂,或与双
氰胺(DICY)类固化剂结合使用,以加速 DICY 固化。